Results of search for 'su:"Microelectronic."'

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	1.	Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown by Ulrich, Richard K Brown, William D, 1943- Series: IEEE Press series on microelectronic systems Edition: 2nd ed. Publication details: Piscataway, N.J. : IEEE Press, 2006 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.A389 2006 3. Place hold
	2.	No cover image available Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / Charles Cohn, Charles A. Harper, [editors] by Cohn, Charles Harper, Charles A Series: McGraw-Hill professional engineering Publication details: New York : McGraw-Hill, 2005 Online resources: Contributor biographical information Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.F356 3. Place hold
	3.	Flip chip technologies / John H. Lau, editor by Lau, John H Series: Electronic packaging and interconnection series Publication details: Boston, Mass. : McGraw-Hill, 1996 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.F584. Place hold
	4.	Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. by Schwizer, Juerg Mayer, M. (Michael Andreas), 1971- Brand, Oliver, 1964- Series: Microtechnology and mems Publication details: Berlin : Springer-Verlag, 2004 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.S34 3. Place hold
	5.	Force Sensors for Microelectronic Packaging Applications [electronic resource] / by Jurg Schwizer, Michael Mayer, Oliver Brand. by Schwizer, Jurg Mayer, Michael Brand, Oliver SpringerLink (Online service) Series: Microtechnology and MEMS Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	6.	Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou by Madou, Marc J Edition: 2nd ed. Publication details: Boca Raton : CRC Press, 2002 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (2)Call number: TK7836.M329 2002, ... Place hold
	7.	Fundamentals of microsystems packaging / Rao R. Tummala, editor by Tummala, Rao R, 1942- Publication details: New York : McGraw-Hill, 2001 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.F863 3. Place hold
	8.	No cover image available Horizon [videorecording] : the future-made in Japan Language: English Publication details: London : BBC Enterprises, 1982 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: video HD9696.2.H67. Place hold
	9.	Hot Cracking Phenomena in Welds [electronic resource] / edited by Thomas Bollinghaus, Horst Herold. by Bollinghaus, Thomas Herold, Horst SpringerLink (Online service) Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	10.	Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan by Tummala, Rao R, 1942- Swaminathan, Madhavan Publication details: New York : McGraw-Hill, 2008 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T864 3. Place hold
	11.	No cover image available Kesan penggunaan substrak berbeza dalam pakej cip tanpa kaki / Mohamad Faizal bin Abdullah. by Mohamad Faizal Abdullah [author.] Producer: 2009 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2009. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M843 2009 3 tesis. Place hold
	12.	MEMS : fundamental technology and applications / edited by Vikas Choudhary, Krzysztof Iniewski. by Choudhary, Vikas [editor.] Iniewski, Krzysztof [editor.] Series: Devices, circuits, and systems \| Devices, circuits, and systemsPublisher: Boca Raton : CRC Press,Taylor & Francis Group, [2013]Copyright date: ©2013 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7875.M457 3. Place hold
	13.	MEMS and microsystems : design and manufacture / Tai-Ran Hsu. by Hsu, Tai-Ran Publication details: Boston : McGraw-Hill, 2002 Online resources: Publisher description Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.H784. Place hold
	14.	Mems and microsystems : design, manufacture, and packaging / Tai-Ran Hsu by Hsu, Tai-Ran Edition: 2nd ed. Publication details: Hoboken, N. J. : John Wiley & Sons, 2008 Online resources: Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.H784 2008 3. Place hold
	15.	MEMS/MOEMS packaging : concepts, designs, materials, and processes / Ken Gilleo by Gilleo, Ken Series: McGraw-Hill nanoscience and technology series Publication details: New York : McGraw-Hill, 2005 Online resources: Table of contents only Contributor biographical information Publisher description Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.G558 3. Place hold
	16.	Microelectronic packaging / edited by M. Datta, T. Osaka, J. W. Schultze. by Datta, Madhav Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter) Series: New trends in electrochemical technology ; v. 3 Publication details: Boca Raton, FL : CRC Press, 2005 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M536 3. Place hold
	17.	Microelectronic packaging [electronic resource] / edited by M. Datta, T. Osaka, J. W. Schultze by Datta, Madhav saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter) Series: New trends in electrochemical technology ; v. 3 Publication details: Boca Raton, FL : CRC Press, c2005 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	18.	No cover image available Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein by Tummala, Rao R, 1942- Rymaszewski, Eugene J Edition: 2nd ed. Publication details: New York : Chapman & Hall, 1997 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (2)Call number: TK7874.M483 1997 3, ... Place hold
	19.	Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee by Lau, John H Lee, S. W. Ricky Publication details: New York : McGraw-Hill, 2001 Online resources: Table of contents Publisher description Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.L31684 3. Place hold
	20.	Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963- Liu, Yong, 1962- Publication details: [Beijing] : Chemical Industry Press, 2011 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L568 3. Place hold

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