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Flip chip technologies / John H. Lau, editor
Series: Electronic packaging and interconnection seriesPublication details: Boston, Mass. : McGraw-Hill, 1996Description: xxiv, 565 p. : ill. ; 24 cmISBN:- 0070366098
| Item type | Current library | Home library | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | TK7874.F584 (Browse shelf(Opens below)) | 1 | Available | 00001299402 |
Includes bibliographical references and index
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