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Flip chip technologies /

Flip chip technologies / John H. Lau, editor - Boston, Mass. : McGraw-Hill, 1996 - xxiv, 565 p. : ill. ; 24 cm. - Electronic packaging and interconnection series .

Includes bibliographical references and index

ISBN: 0070366098 RM357.78

LCCN: 95-044649

Subjects--Topical Terms:
Microelectronic packaging
Multichip modules (Microelectronics)--Design and construction

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