Flip chip technologies / (Record no. 313733)

MARC details
000 -LEADER
fixed length control field 01166cam a2200313 a 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250930114337.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 021115s1996 xxua b 001 0 eng
010 ## - LIBRARY OF CONGRESS CONTROL NUMBER
LC control number 95-044649
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 0070366098
Terms of availability RM357.78
039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE]
Level of rules in bibliographic description 200211181101
Level of effort used to assign nonsubject heading access points farid
Level of effort used to assign subject headings 200211150917
Level of effort used to assign classification sanusi
Level of effort used to assign subject headings 200211150914
Level of effort used to assign classification sanusi
y 11-15-2002
z sanusi
090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN)
Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) TK7874.F584
090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN)
Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) TK7874
245 00 - TITLE STATEMENT
Title Flip chip technologies /
Statement of responsibility, etc. John H. Lau, editor
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. Boston, Mass. :
Name of publisher, distributor, etc. McGraw-Hill,
Date of publication, distribution, etc. 1996
300 ## - PHYSICAL DESCRIPTION
Extent xxiv, 565 p. :
Other physical details ill. ;
Dimensions 24 cm.
440 #0 - SERIES STATEMENT/ADDED ENTRY--TITLE
Title Electronic packaging and interconnection series
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Microelectronic packaging
9 (RLIN) 60415
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Multichip modules (Microelectronics)
General subdivision Design and construction
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Lau, John H.
856 41 - ELECTRONIC LOCATION AND ACCESS
Materials specified Table of contents
Uniform Resource Identifier <a href="http://www.loc.gov/catdir/toc/mh022/95044649.html">http://www.loc.gov/catdir/toc/mh022/95044649.html</a>
907 ## - LOCAL DATA ELEMENT G, LDG (RLIN)
a .b13141089
b 2021-05-28
c 2019-11-12
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type AM
Suppress in OPAC No
Call number prefix TK7874.F584
914 ## - VTLS Number
VTLS Number vtls000327297
990 ## - EQUIVALENCES OR CROSS-REFERENCES [LOCAL, CANADA]
Link information for 9XX fields fa
991 ## - LOCAL NOTE (NAMA FAKULTI/INSTITUT/PUSAT)
a Jabatan Kejuruteraan Elektrik, Elektronik & Sistem
998 ## - LOCAL CONTROL INFORMATION (RLIN)
Library PERPUSTAKAAN LINGKUNGAN KEDUA
Operator's initials, OID (RLIN) 2002-02-11
Cataloger's initials, CIN (RLIN) m
Material Type (Sierra) Printed Books
Language English
Country
-- 0
-- .b13141089
Holdings
Withdrawn status Lost status Damaged status Not for loan Home library Current library Shelving location Date acquired Source of acquisition Cost, normal purchase price Inventory number Total checkouts Full call number Barcode Date last seen Copy number Price effective from Koha item type
        PERPUSTAKAAN LINGKUNGAN KEDUA PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA 12/11/2019 - 357.78 .i17113039 24 TK7874.F584 00001299402 14/09/2025 1 14/09/2025 AM

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