Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.

By:

Liu, S. (Sheng), 1963-

Contributor(s):

Liu, Yong, 1962-

Publication details: [Beijing] : Chemical Industry Press, 2011.Description: xxii, 564 p. : ill. ; 26 cmISBN:

9780470827802 (hbk.)
0470827807 (hbk.)

Subject(s):

Microelectronic packaging -- Simulation methods

Summary: 'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'-- Provided by publisher.

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings
Item type	Current library	Home library	Call number	Materials specified	Copy number	Status	Date due	Barcode
AM	PERPUSTAKAAN LINGKUNGAN KEDUA	PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA	TK7870.15.L568 3 (Browse shelf(Opens below))		1	Available		00002079532

Includes bibliographical references and index.

'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'-- Provided by publisher.

There are no comments on this title.

to post a comment.

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.

Contact Us

Copyright ©The National University of Malaysia Library