Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
Liu, S. 1963-
Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. - [Beijing] : Chemical Industry Press, 2011. - xxii, 564 p. : ill. ; 26 cm.
Includes bibliographical references and index.
'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'--
9780470827802 (hbk.) 0470827807 (hbk.)
Microelectronic packaging--Simulation methods.
Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. - [Beijing] : Chemical Industry Press, 2011. - xxii, 564 p. : ill. ; 26 cm.
Includes bibliographical references and index.
'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'--
9780470827802 (hbk.) 0470827807 (hbk.)
Microelectronic packaging--Simulation methods.