Modeling and simulation for microelectronic packaging assembly : (Record no. 520094)

MARC details
000 -LEADER
fixed length control field 01413nam a2200313 a 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250918162036.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 120515s2011 ch a b 001 0 eng
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780470827802 (hbk.)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 0470827807 (hbk.)
039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE]
Level of rules in bibliographic description 201209111608
Level of effort used to assign nonsubject heading access points zaina
Level of effort used to assign subject headings 201207240926
Level of effort used to assign classification idah
Level of effort used to assign subject headings 201205152110
Level of effort used to assign classification idah
y 05-15-2012
z idah
040 ## - CATALOGING SOURCE
Original cataloging agency DLC
Transcribing agency DLC
Modifying agency YDX
-- BTCTA
-- YDXCP
-- BWX
-- CDX
-- DLC
-- UKM
090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN)
Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) TK7870.15.L568 3
090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN)
Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) TK7870.15
Local cutter number (OCLC) ; Book number/undivided call number, CALL (RLIN) .L568 3
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Liu, S.
Fuller form of name (Sheng),
Dates associated with a name 1963-
245 10 - TITLE STATEMENT
Title Modeling and simulation for microelectronic packaging assembly :
Remainder of title manufacturing, reliability, and testing /
Statement of responsibility, etc. Sheng Liu, Yong Liu.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. [Beijing] :
Name of publisher, distributor, etc. Chemical Industry Press,
Date of publication, distribution, etc. 2011.
300 ## - PHYSICAL DESCRIPTION
Extent xxii, 564 p. :
Other physical details ill. ;
Dimensions 26 cm.
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index.
520 ## - SUMMARY, ETC.
Summary, etc. 'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'--
Assigning source Provided by publisher.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Microelectronic packaging
General subdivision Simulation methods.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Liu, Yong,
Dates associated with a name 1962-
907 ## - LOCAL DATA ELEMENT G, LDG (RLIN)
a .b15363867
b 2019-11-12
c 2019-11-12
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type AM
Suppress in OPAC No
Call number prefix TK7870.15.L568 3
914 ## - VTLS Number
VTLS Number vtls003500817
990 ## - EQUIVALENCES OR CROSS-REFERENCES [LOCAL, CANADA]
Link information for 9XX fields zsz
991 ## - LOCAL NOTE (NAMA FAKULTI/INSTITUT/PUSAT)
a Fakulti Kejuruteraan dan Alam Bina
998 ## - LOCAL CONTROL INFORMATION (RLIN)
Library PERPUSTAKAAN LINGKUNGAN KEDUA
Operator's initials, OID (RLIN) 2012-02-05
Cataloger's initials, CIN (RLIN) m
Material Type (Sierra) Printed Books
Language English
Country
-- 0
-- .b15363867
Holdings
Withdrawn status Lost status Damaged status Not for loan Home library Current library Shelving location Date acquired Source of acquisition Coded location qualifier Cost, normal purchase price Inventory number Total checkouts Full call number Barcode Date last seen Copy number Price effective from Koha item type
        PERPUSTAKAAN LINGKUNGAN KEDUA PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA 12/11/2019 - 1 390.26 .i20074244 1 TK7870.15.L568 3 00002079532 18/09/2025 1 18/09/2025 AM

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