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1.
Conceptual design of multichip modules and systems / Peter A. Sandborn, Hector Moreno by
Publication details: Boston : Kluwer Academic Publishers, 1994
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.S26.

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2.
Flip chip technologies / John H. Lau, editor by Series: Electronic packaging and interconnection series
Publication details: Boston, Mass. : McGraw-Hill, 1996
Online resources:
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.F584.

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3.
Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan by
Publication details: New York : McGraw-Hill, 2008
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T864 3.

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4.
Multichip module design, fabrication and testing James J. Licari. by Series: Electronic packaging and interconnection series
Publication details: New York McGraw-Hill 1995
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L53.

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5.
RF and microwave microelectronics packaging / Ken Kuang, Franklin Kim, Sean S. Cahill, editors by
Publication details: Heidelberg : Springer, 2009
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.R453.

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6.
Thermal management handbook : for electronic assemblies / Jerry Sergent, Al Krum. by Series: Electronic packaging and interconnection series
Publication details: New York : McGraw-Hill, 1998
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.S47.

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