Multichip module design, fabrication and testing James J. Licari.

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Series: Electronic packaging and interconnection seriesPublication details: New York McGraw-Hill 1995.Description: xv, 381 p. : ill. ; 24 cmISBN:

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Holdings
Item type	Current library	Home library	Call number	Materials specified	Copy number	Status	Date due	Barcode
AM	PERPUSTAKAAN LINGKUNGAN KEDUA	PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA	TK7870.15.L53 (Browse shelf(Opens below))		1	Available		00000691473

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