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	1.	No cover image available A study of wire bonded Cu-A1 in microelectronics packaging / Tan Chee Wei by Tan, Chee Wei Publication details: Bangi : Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7874.T36 2002 tesis (00008052077). Place hold
	2.	No cover image available A study of wire bonded Cu-A1 in microelectronics packaging [microform] / Tan Chee Wei by Tan, Chee Wei Publication details: Bangi : Perpustakaan Tun Seri Lanang, 2004 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofilem tesis TK7874.T36 2004. Place hold

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