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A study of wire bonded Cu-A1 in microelectronics packaging / Tan Chee Wei

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Publication details: Bangi : Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002Description: xiv, 123 p. : ill. ; 30 cmSubject(s):

Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002

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Holdings
Item type	Current library	Home library	Call number	Materials specified	Status	Date due	Barcode
TERHAD	PERPUSTAKAAN TUN SERI LANANG	PERPUSTAKAAN TUN SERI LANANG PILIH SIMPAN TESIS-P. TUN SERI LANANG *ARAS 5	TK7874.T36 2002 tesis (00008052077) (Browse shelf(Opens below))		Available		00001341700

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002

References : p. 105-119

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