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A study of wire bonded Cu-A1 in microelectronics packaging /

Tan, Chee Wei

A study of wire bonded Cu-A1 in microelectronics packaging / Tan Chee Wei - Bangi : Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002 - xiv, 123 p. : ill. ; 30 cm.

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002

References : p. 105-119

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Microelectronic packaging
Microeclectronic packaging--Technological innovations

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A study of wire bonded Cu-A1 in microelectronics packaging /

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