Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon.

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Series: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, 1997.Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:

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Holdings
Item type	Current library	Home library	Call number	Materials specified	Copy number	Status	Date due	Barcode
AM	PERPUSTAKAAN LINGKUNGAN KEDUA	PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA	TK7836.H373 1997 (Browse shelf(Opens below))		1	Available		00001302493

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

Includes bibliographical references and index.

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