Wire bonding in microelectronics : materials, processes, reliability, and yield /
Harman, George G.
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. - 2nd ed. - New York : McGraw-Hill, 1997. - xiv, 290 p. : ill. ; 24 cm. - Electronic packaging and interconnection series .
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Includes bibliographical references and index.
0070326193 RM261.30
Wire bonding (Electronic packaging)--Production control
Electronic packaging--Reliability.
Electronic packaging--Defects.
Semiconductors--Failure.
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. - 2nd ed. - New York : McGraw-Hill, 1997. - xiv, 290 p. : ill. ; 24 cm. - Electronic packaging and interconnection series .
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Includes bibliographical references and index.
0070326193 RM261.30
Wire bonding (Electronic packaging)--Production control
Electronic packaging--Reliability.
Electronic packaging--Defects.
Semiconductors--Failure.