Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / by Mohd Salleh Ismail.
Publication details: Davis, Calif: University of California, 1993.Description: 155 p. : ill. ; 30 cmSubject(s): Dissertation note: Thesis (Doctor of Philosophy) - University of California, 1993.| Item type | Current library | Home library | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|
| TERHAD | PERPUSTAKAAN TUN SERI LANANG | PERPUSTAKAAN TUN SERI LANANG PILIH SIMPAN TESIS-P. TUN SERI LANANG *ARAS 5 | TK7871.85.M84 4 (Browse shelf(Opens below)) | 1 | Available | 00000843947 |
Thesis (Doctor of Philosophy) - University of California, 1993.
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