Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices /
Mohd. Salleh Ismail.
Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / by Mohd Salleh Ismail. - Davis, Calif: University of California, 1993. - 155 p. : ill. ; 30 cm.
Thesis (Doctor of Philosophy) - University of California, 1993.
Semiconductor wafers.
Integrated circuits--Water--scale integration.
Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / by Mohd Salleh Ismail. - Davis, Calif: University of California, 1993. - 155 p. : ill. ; 30 cm.
Thesis (Doctor of Philosophy) - University of California, 1993.
Semiconductor wafers.
Integrated circuits--Water--scale integration.