Advances in CMP/polishing technologies for the manufacture of electronic devices /
Advances in CMP/polishing technologies for the manufacture of electronic devices /
CMP polishing technologies for the manufacture of electronic devices
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
- Oxford : Elsevier, c2012.
- xii, 317 p. : ill. ; 24 cm.
Includes bibliographical references and index.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
9781437778595 1437778593
Grinding and polishing.
Chemical mechanical planarization.
Electrolytic polishing.
Includes bibliographical references and index.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
9781437778595 1437778593
Grinding and polishing.
Chemical mechanical planarization.
Electrolytic polishing.