Normal view MARC view ISBD view

Force Sensors for Microelectronic Packaging Applications

Schwizer, Jurg.

Force Sensors for Microelectronic Packaging Applications [electronic resource] / by Jurg Schwizer, Michael Mayer, Oliver Brand. - Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005. - viii, 178 p. : ill., digital ; 24 cm - Microtechnology and MEMS, 1615-8326 .

ISBN: 9783540269458 (electronic bk.) 9783540221876 (paper)

Subjects--Topical Terms:
Microelectronic packaging.
Wire bonding (Electronic packaging)
Chemistry.
Optical and Electronic Materials.
Nanotechnology.
Electronics and Microelectronics, Instrumentation.
Physics and Applied Physics in Engineering.
Quality Control, Reliability, Safety and Risk.

LC Class. No.: TK7870.15 / .S39 2005

Dewey Class. No.: 621.381046

Print
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)

Force Sensors for Microelectronic Packaging Applications

Contact Us

Copyright ©The National University of Malaysia Library