000 01427nam a2200385 i 4500
005 20250930142032.0
008 170704s2016 my a bm 000 0 eng d
039 9 _a201708021427
_blan
_c201707180923
_dhayat
_y07-04-2017
_zhamdan
040 _aUKM
_erda
090 _aTP949.L335 2016 3 tesis
090 _aTP949
_b.L335 2016 3
100 1 _aLai, Chin Yung,
_eauthor.
245 1 0 _aFabrication of a new printing ink with Bimetal system containing tin and silver for leadframe integrated circuit packaging
_cLai Chin Yung.
264 0 _c2016.
300 _axxiii, 183 pages :
_billustrations ;
_c30 cm.
336 _atext
_2rdacontent
337 _aunmediated
_2rdamedia
338 _avolume
_2rdacarrier
500 _aTesis sedang dalam proses di Unit Katalog, PTSL dan telah dihantar pada 7.7.2017.
502 _aThesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2016.
504 _aReferences : page 169-182.
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations.
_962865
650 0 _aink-jet printing.
650 0 _aTin.
650 0 _aPrinting ink.
650 0 _aSilver.
650 0 _aDissertations, Academic
_zMalaysia.
_962866
907 _a.b16490769
_b2025-07-18
_c2019-11-12
942 _c3
_n0
_kTP949.L335 2016 3 tesis
914 _avtls003623743
990 _ahak
991 _aFakulti Kejuruteraan dan Alam Bina
998 _al
_b2017-04-07
_cm
_dx
_feng
_gmy
_y0
_z.b16490769
999 _c622121
_d622121