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039 9 _a201708031104
_bhendon
_c201704271001
_dpraktikum_usim
_y04-25-2017
_zpraktikum_usim
040 _aUKM
_erda
090 _aTK7870.15.N845 2009 3 tesis
090 _aTK7870.15
_b.N845 2009 3
100 0 _aNur Nadia Bachok,
_eauthor.
245 1 0 _aPengoptimuman rekabentuk pakej Quad Flat No-Lead (QFN) Die Bertindan /
_cNur Nadia binti Bachok.
264 0 _c2009.
300 _axii, 116 pages :
_billustrations ;
_c30 cm.
336 _atext
_2rdacontent
337 _aunmediated
_2rdamedia
338 _avolume
_2rdacarrier
502 _aTesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2009.
504 _aRujukan : mukasurat [89]-95.
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations.
_962865
650 0 _aMicroelectronic packaging.
_960415
650 0 _aElectronic packaging.
650 0 _aDissertations, Academic
_zMalaysia.
_962866
907 _a.b16469148
_b2025-07-18
_c2019-11-12
942 _c3
_n0
_kTK7870.15.N845 2009 3 tesis
914 _avtls003621487
990 _armn/ha
991 _aFakulti Kejuruteraan dan Alam Bina
998 _al
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_z.b16469148
999 _c620038
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