000			02295nam a2200385Ki 4500
005			20250919002841.0
008			150330s2014 njua oi 001 0 eng
020			_a9789814508599 _qhardback _cRM478.72
039		9	_a201509020854 _bhayat _c201507221509 _dlan _c201507090913 _dhaiyati _c201507090912 _dhaiyati _y03-30-2015 _zrahah
040			_aNST _beng _erda _epn _cNST _dSTF _dOCLCO _dOCLCF _dUKM _erda
090			_aTK7874.893.S836 3
090			_aTK7874.893 _b.S836 3
100	1		_aSwaminathan, Madhavan, _eauthor.
245	1	0	_aDesign and modeling for 3D ICs and interposers / _cby Madhavan Swaminathan, Ki Jin Han.
264		1	_aHackensack, NJ : _bWorld Scientific, _c[2014].
264		4	_c©2014.
300			_a1 online resource (200 pages).
300			_axxi, 354 pages : _bsome colour illustrations, pictures ; _c23 cm.
336			_atext _2rdacontent
337			_acomputer _2rdamedia
338			_aonline resource _2rdacarrier
490	1		_aWSPC series in advanced integration and packaging ; _v2
504			_aIncludes index.
520			_a3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology, the book introduces 3D ICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
650		0	_aThree-dimensional integrated circuits.
830		0	_aWSPC series in advanced integration and packaging ; _v2
907			_a.b16108814 _b2019-11-12 _c2019-11-12
942			_c01 _n0 _kTK7874.893.S836 3
914			_avtls003582452
990			_anh
991			_aFakulti Kejuruteraan dan Alam Bina
998			_al _b2015-04-03 _cm _da _feng _gnju _y0 _z.b16108814
999			_c589911 _d589911