| 000 | 01410nam a2200361 i 4500 | ||
|---|---|---|---|
| 005 | 20250930140212.0 | ||
| 008 | 150102s2014 my da m 000 0 may d | ||
| 039 | 9 |
_a201502101711 _bathirah _y01-02-2015 _zmiza |
|
| 040 |
_aUKM _erda |
||
| 090 | _aTK7836.M846 2014 3 tesis | ||
| 090 |
_aTK7836 _b.M846 2014 3 |
||
| 100 | 0 |
_aMuhammad Nubli Zulkifli, _eauthor. |
|
| 245 | 1 | 0 |
_aPencirian sambungan pelekatan wayar dengan menggunakan kaedah pelekukan nano / _cMuhammad Nubli bin Zulkifli. |
| 264 | 0 | _c2014. | |
| 300 |
_axxiv, 198 pages : _bcharts, illustrations ; _c30 cm. |
||
| 336 |
_atext _2rdacontent |
||
| 337 |
_aunmediated _2rdamedia |
||
| 338 |
_avolume _2rdacarrier |
||
| 502 | _aTesis (P.hD.) - Universiti Kebangsaan Malaysia, 2014. | ||
| 504 | _aRujukan : mukasurat 179-192. | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations. _962865 |
| 650 | 0 | _aWire bonding (Electronic packaging). | |
| 650 | 0 | _aElectronic packaging. | |
| 650 | 0 |
_aDissertations, Academic _zMalaysia. _962866 |
|
| 907 |
_a.b16050630 _b2025-07-18 _c2019-11-12 |
||
| 942 |
_c3 _n0 _kTK7836.M846 2014 3 tesis |
||
| 914 | _avtls003576029 | ||
| 990 | _armn/athirah | ||
| 991 | _aInstitut Kejuruteraan Mikro dan Nanoelektronik | ||
| 998 |
_al _b2015-02-01 _cm _dx _fmay _gmy _y0 _z.b16050630 |
||
| 999 |
_c584243 _d584243 |
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