000			01310nam a2200337 a 4500
005			20250930135438.0
008			140410s2011 my aol bm 000 0 may
020			_cHadiah
039		9	_y04-10-2014 _zidah
040			_aUKM
090			_aMikrofis tesis TK7836 \b .S235 2013
090			_aMikrofis tesis TK7836 _b.S235 2013
100	0		_aSaidatul Azura Radzi.
245	1	0	_aKesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) _h[microform] / _cSaidatul Azura binti Radzi.
260			_aBangi: _bPerpustakaan Tun Seri Lanang, _c2013
300			_axv, 96 p. : _bill. , photographs, samples ; _c30 cm.
502			_aTesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.
504			_aRujukan : p. [89]-93.
610	2	0	_aUniversiti Kebangsaan Malaysia _xDissertations. _962865
650		0	_aElectric currents.
650		0	_aMetal bonding.
650		0	_aWire bonding (Electronic packaging).
650		0	_aDissertations, Academic _zMalaysia. _962866
907			_a.b15875416 _b2019-11-12 _c2019-11-12
942			_c5 _n0 _kMikrofis tesis TK7836 \b .S235 2013
914			_avtls003556571
990			_aIdah
991			_aBahagian Kioleksi Media
998			_at _b2014-10-04 _cm _da _fmay _gmy _y0 _z.b15875416
999			_c567300 _d567300