000 01193nam a2200325 a 4500
005 20250930134918.0
008 131018s2012 my dal m 000 0 may d
039 9 _a201311260928
_bbaizura
_y10-18-2013
_zzarina
040 _aUKM
090 _aTK7870.16.Z337 2012 tesis
090 _aTK7870.16
_b.Z337 2012
100 0 _aZainudin Kornain.
245 1 0 _aPenyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
_cZainudin bin Kornain.
260 _c2012.
300 _axix, 200 p. :
_bcharts, samples, ill. ;
_c30 cm.
502 _aTesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2012.
504 _aRujukan : p. [179]-197.
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations.
_962865
650 0 _aDissertations, Academic
_zMalaysia.
_962866
650 0 _aFlip chip technology.
650 0 _aElectronic packaging.
650 0 _aBall grid array technology.
_965334
907 _a.b15751004
_b2020-09-28
_c2019-11-12
942 _c3
_n0
_kTK7870.16.Z337 2012 tesis
914 _avtls003542587
990 _aszj/nm
991 _aPusat Pengajian Siswazah.
998 _at
_b2013-05-10
_cm
_dx
_fmay
_gmy
_y0
_z.b15751004
999 _c555274
_d555274