000 01396nam a2200349 a 4500
005 20250930134506.0
008 130510s2011 my aol bm 000 0 may
020 _cHadiah
039 9 _a201305301241
_blan
_c201305291436
_dhendon
_c201305271659
_dhendon
_y05-10-2013
_znorehan
040 _aUKM
090 _aTK7836.S235 2011 tesis
090 _aTK7836
_b.S235 2011
100 0 _aSaidatul Azura Radzi.
245 1 0 _aKesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
_cSaidatul Azura binti Radzi.
260 _c2011.
300 _axv, 96 p. :
_bill. , photographs, samples ;
_c30 cm.
502 _aTesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.
504 _aRujukan : p. [89]-93.
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations.
_962865
650 0 _aElectric currents.
650 0 _aMetal bonding.
650 0 _aWire bonding (Electronic packaging).
650 0 _aDissertations, Academic
_zMalaysia.
_962866
907 _a.b15633779
_b2020-09-28
_c2019-11-12
942 _c3
_n0
_kTK7836.S235 2011 tesis
914 _avtls003529733
990 _ank/ha
991 _aFakulti Sains dan Teknologi
998 _at
_b2013-10-05
_cm
_dx
_fmay
_gmy
_y0
_z.b15633779
999 _c546140
_d546140