000 01224nam a2200313 a 4500
005 20250930134454.0
008 130502s2009 my da m 000 0 eng d
020 _cHadiah
039 9 _a201307050932
_bariff
_c201307021721
_dnikzal
_c201306261750
_dnikzal
_c201306211713
_dnikzal
_y05-02-2013
_znorehan
040 _aUKM
090 _aTK870.16.A546 2009 3tesis
090 _aTK7870.16
_b.A546 2009
100 1 _aAng, Ye Cheah.
245 1 3 _aAn investigation of clean and no-clean flux in enhancing the reliability of flip chip plastic ball grid array (PBGA) package /
_cAng Ye Cheah.
260 _c2009.
300 _axvi, 68 p. :
_bcharts, ill. ;
_c30 cm.
502 _aThesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2009.
504 _aReferences : p. [62]-66.
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations.
_962865
650 0 _aDissertations, Academic
_zMalaysia.
_962866
650 0 _aBall grid array technology.
_965334
907 _a.b15628309
_b2025-07-18
_c2019-11-12
942 _c3
_n0
_kTK870.16.A546 2009 3tesis
914 _avtls003529158
990 _ank/nz
991 _aFakulti Kejuruteraan dan Alam Bina
998 _al
_b2013-02-05
_cm
_dx
_feng
_gmy
_y0
_z.b15628309
999 _c545625
_d545625