000			01394nam a2200361 a 4500
005			20250930133959.0
008			121029s2011 my daol m 000 0 may d
039		9	_a201212121635 _blan _c201212070959 _dhendon _y10-29-2012 _zzarina
040			_aUKM
090			_aTK7870.15.N847 2011 3tesis
090			_aTK7870.15 _b.N846 2011 3
100	0		_aNurul Hidayah Mohamad Nor.
245	1	0	_aPencirian morfologi permukaan kapilari bagi hasil keluaran lekatan wayar pakej ultra fine pitch large quad flat / _cNurul Hidayah Mohamad Nor.
260			_c2011.
300			_axiii, 102 p : _bill. charts, samples, photographs, ; _c30 cm.
502			_aThesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2011.
504			_aRujukan : p. 97-101.
610	2	0	_aUniversiti Kebangsaan Malaysia _xDissertations. _962865
650		0	_aDissertations, Academic _zMalaysia. _962866
650		0	_aElectric wiring.
650		0	_aMicroelectronics. _960418
650		0	_aSurface mount technology.
650		0	_aElectronic packaging.
650		0	_aWire bonding (Electronic packaging).
650		0	_aFine pitch technology.
907			_a.b15513397 _b2025-07-18 _c2019-11-12
942			_c3 _n0 _kTK7870.15.N847 2011 3tesis
914			_avtls003516933
990			_aszj/ha
991			_aFakulti Kejuruteraan dan Alam Bina.
998			_al _b2012-03-10 _cm _dx _fmay _gmy _y0 _z.b15513397
999			_c534423 _d534423