| 000 | 01413nam a2200313 a 4500 | ||
|---|---|---|---|
| 005 | 20250918162036.0 | ||
| 008 | 120515s2011 ch a b 001 0 eng | ||
| 020 | _a9780470827802 (hbk.) | ||
| 020 | _a0470827807 (hbk.) | ||
| 039 | 9 |
_a201209111608 _bzaina _c201207240926 _didah _c201205152110 _didah _y05-15-2012 _zidah |
|
| 040 |
_aDLC _cDLC _dYDX _dBTCTA _dYDXCP _dBWX _dCDX _dDLC _dUKM |
||
| 090 | _aTK7870.15.L568 3 | ||
| 090 |
_aTK7870.15 _b.L568 3 |
||
| 100 | 1 |
_aLiu, S. _q(Sheng), _d1963- |
|
| 245 | 1 | 0 |
_aModeling and simulation for microelectronic packaging assembly : _bmanufacturing, reliability, and testing / _cSheng Liu, Yong Liu. |
| 260 |
_a[Beijing] : _bChemical Industry Press, _c2011. |
||
| 300 |
_axxii, 564 p. : _bill. ; _c26 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 520 |
_a'This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation'-- _cProvided by publisher. |
||
| 650 | 0 |
_aMicroelectronic packaging _xSimulation methods. |
|
| 700 | 1 |
_aLiu, Yong, _d1962- |
|
| 907 |
_a.b15363867 _b2019-11-12 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7870.15.L568 3 |
||
| 914 | _avtls003500817 | ||
| 990 | _azsz | ||
| 991 | _aFakulti Kejuruteraan dan Alam Bina | ||
| 998 |
_al _b2012-02-05 _cm _da _feng _gch _y0 _z.b15363867 |
||
| 999 |
_c520094 _d520094 |
||