000			01499nam a2200349 a 4500
005			20250918162036.0
008			120515s2011 si a b 001 0 eng
020			_a9780470827833 (hbk.)
020			_a0470827831 (hbk.)
039		9	_a201209111615 _bzaina _c201207240924 _didah _y05-15-2012 _zidah
040			_aDLC _cDLC _dYDX _dBTCTA _dYDXCP _dBWX _dCDX _dUKMGB _dDLC _dUKM
090			_aTK7871.89.L53L568 3
090			_aTK7871.89.L53 _bL568 3
100	1		_aLiu, S. _q(Sheng), _d1963-
245	1	0	_aLED packaging for lighting applications : _bdesign, manufacturing and testing / _cSheng Liu, Xiaobing Luo.
260			_aSingapore : _bJohn Wiley & Sons (Asia), _c2011.
300			_axx, 352 p. : _bill. ; _c26 cm.
504			_aIncludes bibliographical references and index.
520			_a'This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved'-- _cProvided by publisher.
650		0	_aLight emitting diodes _xDesign and construction.
650		0	_aLight emitting diodes _xComputer simulation.
650		0	_aElectronic packaging.
650		0	_aElectric lighting _xEquipment and supplies.
700	1		_aLuo, Xiaobing, _d1974-
907			_a.b15363855 _b2019-11-12 _c2019-11-12
942			_c01 _n0 _kTK7871.89.L53L568 3
914			_avtls003500816
990			_azsz
991			_aFakulti Kejuruteraan dan Alam Bina
998			_al _b2012-02-05 _cm _da _feng _gsi _y0 _z.b15363855
999			_c520093 _d520093