000			01460nam a22003617a 4500
005			20250918162028.0
008			120515s2012 enka b 000 0 eng d
020			_a9781437778595
020			_a1437778593
039		9	_a201209211550 _bbaiti _c201207250905 _didah _c201205151255 _didah _y05-15-2012 _zidah
040			_aUKM
090			_aTJ1280.A388
090			_aTJ1280 _b.A388
245	0	0	_aAdvances in CMP/polishing technologies for the manufacture of electronic devices / _cedited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
246	1	0	_aCMP polishing technologies for the manufacture of electronic devices
260			_aOxford : _bElsevier, _cc2012.
300			_axii, 317 p. : _bill. ; _c24 cm.
504			_aIncludes bibliographical references and index.
520			_aCMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
650		0	_aGrinding and polishing.
650		0	_aChemical mechanical planarization.
650		0	_aElectrolytic polishing.
700	1		_aDoi, Toshiro K., _d1947- _4edt
700	1		_aMarinescu, Ioan D. _4edt
700	1		_aKurokawa, Syuhei _4edt
907			_a.b15362310 _b2019-11-12 _c2019-11-12
942			_c01 _n0 _kTJ1280.A388
914			_avtls003500615
990			_abaiti
991			_aFakulti Kejuruteraan dan Alam Bina
998			_at _b2012-02-05 _cm _da _feng _genk _y0 _z.b15362310
999			_c519939 _d519939