| 000 | 01333nam a2200349 a 4500 | ||
|---|---|---|---|
| 005 | 20250918162026.0 | ||
| 008 | 120515s2011 maua b 001 0 eng | ||
| 020 | _a9781437778892 | ||
| 039 | 9 |
_a201208051432 _bzaina _c201207172015 _didah _c201205151203 _didah _y05-15-2012 _zidah |
|
| 040 |
_aDLC _cDLC _dDLC _dUKM |
||
| 090 | _aTK7871.L534 2011 3 | ||
| 090 |
_aTK7871 _b.L534 2011 3 |
||
| 100 | 1 |
_aLicari, James J., _d1930- |
|
| 245 | 1 | 0 |
_aAdhesives technology for electronic applications : _bmaterials, processing, reliability / _cJames J. Licari and Dale W. Swanson. |
| 250 | _a2nd ed. | ||
| 260 |
_aWaltham, MA : _bWilliam Andrew Pub., _c2011. |
||
| 300 |
_aviii, 403 p. : _bill. ; _c24 cm. |
||
| 490 | 0 | _aMaterials and processes for electronic applications series | |
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aElectronics _xMaterials. |
|
| 650 | 0 | _aAdhesives. | |
| 650 | 0 | _aElectronic packaging. | |
| 700 | 1 | _aSwanson, Dale W. | |
| 856 | 4 | 1 |
_3Table of contents only _uhttp://www.loc.gov/catdir/toc/fy12pdf01/2011292645.html |
| 907 |
_a.b1536186x _b2019-11-12 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7871.L534 2011 3 |
||
| 914 | _avtls003500565 | ||
| 990 | _azsz | ||
| 991 | _aFakulti Kejuruteraan dan Alam Bina | ||
| 998 |
_al _b2012-02-05 _cm _da _feng _gmau _y0 _z.b1536186x |
||
| 999 |
_c519894 _d519894 |
||