| 000 | 01459nam a2200361 a 4500 | ||
|---|---|---|---|
| 005 | 20250918145324.0 | ||
| 006 | m d | ||
| 007 | cr nn 008maaau | ||
| 008 | 110924s2009 mau s j eng d | ||
| 020 |
_a9780387793948 _qelectronic book |
||
| 039 | 9 |
_a201110031822 _bruzita _c201109241434 _druzita _y09-24-2011 _zruzita |
|
| 100 | 1 | _aPerkins, Andrew E. | |
| 245 | 1 | 0 |
_aSolder joint reliability prediction for multiple environments _h[electronic resource] / _cby Andrew E. Perkins, Suresh K. Sitaraman. |
| 260 |
_aBoston, MA : _bSpringer Science+Business Media, LLC, _c2009. |
||
| 300 |
_axv, 192 pages : _billustrations, digital. |
||
| 650 | 0 |
_aElectronic apparatus and appliances _xReliability. |
|
| 650 | 0 |
_aJoints (Engineering) _xReliability. |
|
| 650 | 0 | _aSolder and soldering. | |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aMetallic Materials. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 650 | 2 | 4 | _aQuality Control, Reliability, Safety and Risk. |
| 700 | 1 | _aSitaraman, Suresh K. | |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 856 | 4 | 0 | _uhttps://eresourcesptsl.ukm.remotexs.co/login?url=http://dx.doi.org/10.1007/978-0-387-79394-8 |
| 907 |
_a.b15162850 _b2024-02-26 _c2019-11-12 |
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| 942 | _n0 | ||
| 914 | _avtls003479389 | ||
| 998 |
_ae _b2011-11-09 _cm _dz _feng _gmau _y0 _z.b15162850 |
||
| 999 |
_c500533 _d500533 |
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