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| 007 | cr nn 008maaau | ||
| 008 | 101230s2010 mau s j eng d | ||
| 020 | _a9781441909848 (electronic bk.) | ||
| 035 | _a(Springer)978-1-4419-0983-1 | ||
| 039 | 9 |
_y12-30-2010 _zmuhaimin |
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| 082 | 0 | 4 |
_a621.381046 _222 |
| 245 | 0 | 0 |
_aRF and Microwave Microelectronics Packaging _h[electronic resource] / _cedited by Ken Kuang, Franklin Kim, Sean S. Cahill. |
| 260 |
_aBoston, MA : _bSpringer Science+Business Media, LLC, _c2010. |
||
| 300 |
_axiv, 284 p. : _bill., digital. |
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| 650 | 0 |
_aMicroelectronic packaging. _960415 |
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| 650 | 2 | 4 | _aCircuits and Systems |
| 650 | 2 | 4 | _aMicrowaves, RF and Optical Engineering |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation |
| 650 | 1 | 4 | _aEngineering |
| 700 | 1 | _aKuang, Ken. | |
| 700 | 1 | _aCahill, Sean S. | |
| 700 | 1 | _aKim, Franklin. | |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 856 | 4 | 0 | _uhttps://eresourcesptsl.ukm.remotexs.co/user/login?url=http://dx.doi.org/10.1007/978-1-4419-0984-8 |
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