000			01484nam a2200349 a 4500
005			20250918122552.0
008			101021s2010 nyua b 001 0 eng
020			_a9780071476232 : _cRM260.68
039		9	_a201011081127 _bzabidah _c201011081126 _dzabidah _y10-21-2010 _zfarid
040			_aUKM
090			_aTK7836.H373 2010 3
090			_aTK7836 _b.H373 2010
100	1		_aHarman, George G.
245	1	0	_aWire bonding in microelectronics / _cGeorge G. Harmon
250			_a3rd ed.
260			_aNew York : _bMcGraw-Hill, _c2010
300			_axx, 426 p. : _bill. ; _c24 cm. + _e1 computer optical disc (4 3/4 in.)
500			_aRev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989
500			_aBook is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media
650		0	_aWire bonding (Electronic packaging) _xProduction control
650		0	_aElectronic packaging _xReliability
650		0	_aElectronic packaging _xDefects
650		0	_aSemiconductors _xFailures
700	1		_aHarman, George G. _tReliability and yield problems of wire bonding in microelectronics
907			_a.b14820183 _b2021-05-28 _c2019-11-12
942			_c01 _n0 _kTK7836.H373 2010 3
914			_avtls003443323
990			_aza
991			_aPusat Pengajian Fizik Gunaan (QFG)
998			_al _b2010-08-10 _cm _da _feng _gnyu _y0 _z.b14820183
999			_c468736 _d468736