000 01041cam a22003015a 4500
005 20250930130940.0
008 101012s2009 nyua i 001 0 eng
020 _a9781441909831
_cRM378.71
039 9 _a201010261212
_blan
_c201010211628
_dhayat
_c201010210935
_dhayat
_c201010121202
_dfarid
_y10-12-2010
_zfarid
040 _aUKM
090 _aTK7874.R453
090 _aTK7874
_b.R453
245 0 0 _aRF and microwave microelectronics packaging /
_cKen Kuang, Franklin Kim, Sean S. Cahill, editors
260 _aHeidelberg :
_bSpringer,
_c2009
300 _axvi, 285 p. :
_bill. ;
_c24 cm.
650 0 _aMultichip modules (Microelectronics)
650 0 _aMicroelectronic packaging
_960415
700 1 _aKuang, Ken
700 1 _aKim, Franklin
700 1 _aCahill, Sean S.
907 _a.b14813415
_b2021-05-28
_c2019-11-12
942 _c01
_n0
_kTK7874.R453
914 _avtls003442623
990 _ahg/rab
991 _aPusat Pengajian Fizik Gunaan - QFG
998 _al
_b2010-12-10
_cm
_da
_feng
_gnyu
_y0
_z.b14813415
999 _c468065
_d468065