000 01164nam a2200301 a 4500
005 20250930125758.0
008 090713s2008 nyua b 001 0 eng
020 _a0071459065 (hbk.)
020 _a9780071459068 (hbk.) :
_cRM443.75
039 9 _a200910010851
_bbedah
_c200908241221
_drasyilla
_y07-13-2009
_zbinar
090 _aTK7870.15.T864 3
090 _aTK7870.15
_b.T864
100 1 _aTummala, Rao R.,
_d1942-
245 1 0 _aIntroduction to system-on-package (SOP) :
_bminiaturization of the entire system /
_cRao R. Tummala, Madhavan Swaminathan
260 _aNew York :
_bMcGraw-Hill,
_c2008
300 _axx, 785 p. :
_bill. ;
_c25 cm.
504 _aIncludes bibliographical references and index
650 0 _aMultichip modules (Microelectronics)
_xDesign and construction
650 0 _aMicroelectronic packaging
_960415
700 1 _aSwaminathan, Madhavan
907 _a.b14545111
_b2020-10-15
_c2019-11-12
942 _c01
_n0
_kTK7870.15.T864 3
914 _avtls003414420
990 _aza
991 _aInstitut Kejuruteraan Mikro dan Nanoelektronik (IMEN) - Pasca
998 _al
_b2009-01-07
_cm
_da
_feng
_gnyu
_y0
_z.b14545111
999 _c446689
_d446689