000			01287nam a2200325 a 4500
005			20250930125745.0
008			090708s2008 my da m 000 0 may
039		9	_a200908121012 _bmaslia _c200907081036 _dnorehan _c200907081034 _dnorehan _y07-08-2009 _znorehan
040			_aUKM
090			_aTS610.M836 2008 tesis 3
090			_aTS610 _b.M836 2008 3
100	0		_aMuhammad Najib Harif
245	1	0	_aKeboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor / _cMuhammad Najib bin Harif
260			_a2008
300			_axii, 117 p. : _bcharts, ill. ; _c30 cm.
502			_aTesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008
504			_aRujukan : p. 80-86
610	2	0	_aUniversiti Kebangsaan Malaysia _xDissertations _962865
650		0	_aDissertations, Academic _zMalaysia _962866
650		0	_aSolder and soldering
650		0	_aLead-free electronics manufacturing processes
650		0	_aBall grid array technology _965334
907			_a.b14540423 _b2020-10-15 _c2019-11-12
942			_c3 _n0 _kTS610.M836 2008 tesis 3
914			_avtls003413900
990			_anmk
991			_aFakulti Kejuruteraan dan Alam Bina
998			_al0013 _b2009-08-07 _cm _dx _fmay _gmy _y0 _z.b14540423
999			_c446256 _d446256