000 01290nam a2200349 a 4500
005 20250930125304.0
007 he amu baau
008 090317s2006 my a m 000 0 may
039 9 _y03-17-2009
_zmanan
040 _aUKM
_erda
090 _amikrofis tesis TK7871.85 H468 2009
090 _amikrofis tesis TK7871.85
_b. H648 2009
100 1 _aHoh, Huey Jiun
_eauthor.
245 1 0 _aKesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan /
_cHoh Huey Jiun
264 1 _aBangi :
_bPerpustakaan Tun Seri Lanang,
_c2009
300 _a2 microfishes ;
_c11 x 15 cm.
336 _atext
_2rdacontent
337 _amicroform
_2rdamedia
338 _amicrofiche
_2rdacarrier
502 _aTesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2006
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations
_962865
650 0 _aDissertations, Academic
_zMalaysia.
_962866
650 0 _aSemiconductor wafers
_xDesign and construction.
650 0 _aSemiconductor.
650 0 _aIntegrated circuits.
907 _a.b14436048
_b2020-12-14
_c2019-11-12
942 _c3
_n0
_kmikrofis tesis TK7871.85 H468 2009
914 _avtls003402846
990 _amn
991 _akoleksi Media
998 _at
_b2009-04-03
_cm
_dy
_fmay
_gmy
_y0
_z.b14436048
999 _c436159
_d436159