000			01661nam a22004335a 4500
005			20251203090752.0
006			m q d
007			cr nn 008maaau
008			090204s2007 mau q j eng d
020			_a9780387329895 (electronic bk.)
020			_a9780387279749 (paper)
035			_a(Springer)978-0-387-27974-9
039		9	_y02-04-2009 _zmuhaimin
090			_aTA160 _b.M626 2007
245	0	0	_aMicro- and Opto-Electronic Materials and Structures : _bPhysics, Mechanics, Design, Reliability, Packaging _h[electronic resource] / _cedited by E. Suhir, Y. C. Lee, C. P. Wong.
260			_aBoston, MA : _bSpringer Science+Business Media, LLC, _c2007.
300			_a1 v. : _bill. (some col.), digital ; _c26 cm.
650		0	_aMicroelectronics. _960418
650		0	_aOptoelectronics.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aEngineering Design.
650	2	4	_aSolid State Physics and Spectroscopy.
650	2	4	_aSurfaces and Interfaces, Thin Films.
650	2	4	_aQuality Control, Reliability, Safety and Risk.
700	1		_aSuhir, E.
700	1		_aLee, Y. C.
700	1		_aWong, C. P.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer e-books
856	4	0	_uhttps://eresourcesptsl.ukm.remotexs.co/user/login?url=http://dx.doi.org/10.1007/0-387-32989-7
907			_a.b1439196x _b2021-06-25 _c2019-11-12
914			_avtls003398164
942			_n0 _kTA160 .M626 2007 _2lcc
998			_ae0001 _b2009-04-02 _cm _da _feng _gmau
999			_c433940 _d433940