000			01652nam a22004215a 4500
005			20250930125044.0
006			m d
007			cr nn 008maaau
008			100623s2008 gw j eng d
020			_a9783540766643 (electronic bk.)
020			_a9783540766629 (paper)
035			_a(Springer)978-3-540-76662-9
039		9	_a201006230835 _bmuhaimin _y02-02-2009 _zmuhaimin
082	0	4	_a621.38152 _222
090			_aTK7871.88 _b.R281 2008
245	0	0	_aReactive Sputter Deposition _h[electronic resource] / _cedited by Diederik Depla, Stijn Mahieu.
260			_aBerlin, Heidelberg : _bSpringer-Verlag Berlin Heidelberg, _c2008.
300			_axviii, 570 p. : _bill. (some col.), digital ; _c25 cm.
440		0	_aSpringer Series in Materials Science, _x0933-033X ; _v109
650		0	_aCathode sputtering (Plating process)
650		0	_aThin films.
650	1	4	_aChemistry. _959425
650	2	4	_aCondensed Matter.
650	2	4	_aIndustrial Chemistry/Chemical Engineering.
650	2	4	_aPhysical Chemistry.
650	2	4	_aSurfaces and Interfaces, Thin Films.
700	1		_aDepla, Diederik.
700	1		_aMahieu, Stijn.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
856	4	0	_uhttps://eresourcesptsl.ukm.remotexs.co/user/login?url=http://www.springerlink.com/openurl.asp?genre=book&isbn=978-3-540-76664-3
907			_a.b14374389 _b2024-02-05 _c2019-11-12
942			_n0 _kTK7871.88 .R281 2008
914			_avtls003396309
998			_ae0001 _b2009-02-02 _cm _dz _feng _ggw _y0 _z.b14374389
999			_c432198 _d432198