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008 100623s2008 gw j eng d
020 _a9783540736073 (electronic bk.)
020 _a9783540736059 (paper)
035 _a(Springer)978-3-540-73605-9
039 9 _a201006230941
_bmuhaimin
_c201006221817
_dmuhaimin
_y02-02-2009
_zmuhaimin
082 0 4 _a660.2842
_222
090 _aTP156.S45
_bW872 2008
100 1 _aWong, Basil T.
245 1 0 _aThermal Transport for Applications in Micro/Nanomachining
_h[electronic resource] /
_cby Basil T. Wong, M. Pinar Menguc.
260 _aBerlin, Heidelberg :
_bSpringer-Verlag Berlin Heidelberg,
_c2008.
300 _axvii, 231 p. :
_bill., digital ;
_c24 cm.
440 0 _aMicrotechnology and MEMS,
_x1615-8326
650 0 _aNanostructured materials
_xTransport properties.
650 0 _aMachining.
650 0 _aNanotechnology.
650 1 4 _aChemistry.
_959425
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aNanotechnology.
650 2 4 _aPhysics and Applied Physics in Engineering.
650 2 4 _aThermodynamics.
700 1 _aMenguc, M. Pinar.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
856 4 0 _u
_uhttps://eresourcesptsl.ukm.remotexs.co/user/login?url=http://link.springer.com/10.1007/978-3-540-73607-3
907 _a.b14372101
_b2024-01-22
_c2019-11-12
942 _n0
_kTP156.S45 W872 2008
914 _avtls003396077
998 _ae0001
_b2009-02-02
_cm
_da
_feng
_ggw
_y0
_z.b14372101
999 _c431970
_d431970