000 01203nam a2200325 a 4500
005 20250930124701.0
008 081023s2008 njua b 001 0 eng
020 _a9780470083017 (hbk.)
_cRM415.02
039 9 _a200811071557
_bbedah
_c200810231012
_drasyilla
_y10-23-2008
_zrasyilla
040 _aUKM
090 _aTK7874.H784 2008 3
090 _aTK7874
_b.H784 2008
100 1 _aHsu, Tai-Ran
245 1 0 _aMems and microsystems :
_bdesign, manufacture, and packaging /
_cTai-Ran Hsu
250 _a2nd ed.
260 _aHoboken, N. J. :
_bJohn Wiley & Sons,
_c2008
300 _axxv, 550 p. :
_bill. ;
_c24 cm.
504 _aIncludes bibliographical references and index
650 0 _aMicroelectronics
_960418
650 0 _aMicroelectromechanical systems
650 0 _aMicroelectronic packaging
_960415
856 4 1 _3Table of contents only
_uhttp://www.loc.gov/catdir/toc/ecip0716/2007017041.html
907 _a.b14289374
_b2021-05-28
_c2019-11-12
942 _c01
_n0
_kTK7874.H784 2008 3
914 _avtls003387461
990 _aza
991 _aInstitut Kejuruteraan Mikro dan Nanoelektronik (IMEN) - Pasca
998 _al
_b2008-10-10
_cm
_da
_feng
_gnju
_y0
_z.b14289374
999 _c423953
_d423953