000 01313nam a2200325 a 4500
005 20250930124304.0
008 080604s2008 my a m 000 0 eng
039 9 _a201212131555
_byah
_c200902131703
_dlaili
_c200806051211
_dnorehan
_y06-04-2008
_zshahrur
040 _aUKM
090 _aTK7874.A9978 2008 3tesis
090 _aTK7874
_b.A9978 2008 3
100 0 _aAzrul Azlan Hamzah
245 1 0 _aSputtered silicon encapsulation :
_bwafer level packaging for MEMs devices /
_cAzrul Azlan Bin Hamzah
260 _aBangi :
_bInstitut Kejuruteraan Mikro dan Nanoelektronik, Universiti Kebangsaan Malaysia,
_c2008
300 _axxxv, 338 p. :
_bill. ;
_c30 cm.
502 _aThesis (Ph.D) - Universiti Kebangsaan Malaysia, 2008
504 _aReferences : p. [315] - 327
610 2 0 _aUniversiti Kebangsaan Malaysia
_xDissertations
_962865
650 0 _aDissertations, Academic
_zMalaysia
_962866
650 0 _aMicroelectronic packaging
_960415
650 0 _aMicroelectromechanical systems
650 0 _aMicroelectronic
907 _a.b14206249
_b2025-07-18
_c2019-11-12
942 _c3
_n0
_kTK7874.A9978 2008 3tesis
914 _avtls003378543
990 _anmk/NY/nms
991 _aInstitut Kejuruteraan Mikro dan Nanoelektronik
998 _al
_b2008-04-06
_cm
_dx
_feng
_gmy
_y0
_z.b14206249
999 _c416020
_d416020