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| 008 | 090212s2006 ne q j eng d | ||
| 020 | _a9781402045899 (electronic bk.) | ||
| 035 | _a(Springer)978-1-4020-4578-3 | ||
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| 100 | 1 | _aDziuban, Jan A. | |
| 245 | 1 | 0 |
_aBonding in Microsystem Technology _h[electronic resource] / _cby Jan A. Dziuban. |
| 260 |
_aDordrecht : _bSpringer, _c2006. |
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| 300 |
_axviii, 331 p. : _bill., digital ; _c25 cm. |
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| 490 | 0 |
_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v24 |
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| 650 | 0 | _aMicrotechnology. | |
| 650 | 0 | _aMicromachining. | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aPhysics and Applied Physics in Engineering. |
| 650 | 2 | 4 | _aContinuum Mechanics and Mechanics of Materials. |
| 650 | 2 | 4 | _aOperating Procedures, Materials Treatment. |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer e-books | |
| 856 | 4 | 0 | _uhttps://eresourcesptsl.ukm.remotexs.co/user/login?url=http://dx.doi.org/10.1007/1-4020-4589-1 |
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