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| 005 | 20250930123706.0 | ||
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| 007 | cr nn 008maaau | ||
| 008 | 090217s2005 gw j eng d | ||
| 020 | _a9783540269458 (electronic bk.) | ||
| 020 | _a9783540221876 (paper) | ||
| 035 | _a(Springer)978-3-540-22187-6 | ||
| 039 | 9 |
_a200902171845 _bmuhaimin _y04-03-2008 _zmuhaimin |
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_aTK7870.15 _b.S39 2005 |
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_a621.381046 _222 |
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_aTK7870.15 _b.S415 2005 |
||
| 100 | 1 | _aSchwizer, Jurg. | |
| 245 | 1 | 0 |
_aForce Sensors for Microelectronic Packaging Applications _h[electronic resource] / _cby Jurg Schwizer, Michael Mayer, Oliver Brand. |
| 260 |
_aBerlin, Heidelberg : _bSpringer-Verlag Berlin Heidelberg, _c2005. |
||
| 300 |
_aviii, 178 p. : _bill., digital ; _c24 cm |
||
| 440 | 0 |
_aMicrotechnology and MEMS, _x1615-8326 |
|
| 650 | 0 |
_aMicroelectronic packaging. _960415 |
|
| 650 | 0 | _aWire bonding (Electronic packaging) | |
| 650 | 1 | 4 |
_aChemistry. _959425 |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 650 | 2 | 4 | _aNanotechnology. |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aPhysics and Applied Physics in Engineering. |
| 650 | 2 | 4 | _aQuality Control, Reliability, Safety and Risk. |
| 700 | 1 | _aMayer, Michael. | |
| 700 | 1 | _aBrand, Oliver. | |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer e-books | |
| 856 | 4 | 0 | _uhttps://eresourcesptsl.ukm.remotexs.co/login?url=http://dx.doi.org/10.1007/b138345 |
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_a.b14102663 _b2022-04-06 _c2019-11-12 |
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_n0 _kTK7870.15 .S415 2005 |
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