| 000 | 01313nam a2200325 a 4500 | ||
|---|---|---|---|
| 005 | 20250930123449.0 | ||
| 008 | 080122s2007 my a m 000 0 may | ||
| 020 | _cHadiah | ||
| 039 | 9 |
_a200805271055 _bfati _c200801240850 _dnorehan _y01-22-2008 _znorehan |
|
| 040 | _aUKM | ||
| 090 | _aTK7871.85.S58 2007 tesis 3 | ||
| 090 |
_aTK7871.85 _b.S58 2007 3 |
||
| 100 | 0 | _aSiti Hajar Abdullah | |
| 245 | 1 | 0 |
_aKeboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) / _cSiti Hajar Abdullah |
| 260 |
_aBangi : _bFakulti Kejuruteraan, Universiti Kebangsaan Malaysia, _c2007 |
||
| 300 |
_axix, 124 p. : _bill. ; _c30 cm. |
||
| 502 | _aTesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2007 | ||
| 504 | _aRujukan : p. [111]-120 | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations _962865 |
| 650 | 0 |
_aDissertations, Academic _zMalaysia _962866 |
|
| 650 | 0 |
_aIntegrated circuits _xWafer _xscale integration |
|
| 650 | 0 | _aSemiconductor wafers | |
| 907 |
_a.b14052489 _b2021-05-28 _c2019-11-12 |
||
| 942 |
_c3 _n0 _kTK7871.85.S58 2007 tesis 3 |
||
| 914 | _avtls003362429 | ||
| 990 | _anmk/fka | ||
| 991 | _aFakulti Kejuruteraan | ||
| 998 |
_al0013 _b2008-09-01 _cm _dx _fmay _gmy _y0 _z.b14052489 |
||
| 999 |
_c401390 _d401390 |
||