000			01481cam a22003734a 4500
005			20250914162731.0
008			071102s2007 flua bi 001 0 eng
020			_a9780849335570 (alk. paper)
020			_a0849335574 (alk. paper) _cRM482.93
020			_a1420018965 (alk. paper)
020			_a9781420018967 (alk. paper)
039		9	_a200803211515 _bariff _c200802200849 _didah _c200711021105 _drahah _y11-02-2007 _zrahah
040			_aUKM
090			_aTK7871.15.C4C465
090			_aTK7871.15.C4 _bC465
245	0	0	_aCeramic interconnect technology handbook / _cedited by Fred D. Barlow III, Aicha Elshabini
260			_aBoca Raton : _bCRC Press/Taylor & Francis, _c2007
300			_a441 p. : _bill. ; _c25 cm.
504			_aIncludes bibliographical references and index
650		0	_aElectronic ceramics
650		0	_aElectronic packaging _xMaterials
650		0	_aInterconnects (Integrated circuit technology) _xDesign and construction
700	1		_aBarlow, Fred D.
700	1		_aElshabini, Aicha.
856	4	1	_3Table of contents only _uhttp://www.loc.gov/catdir/toc/ecip0618/2006024037.html
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0727/2006024037-d.html
907			_a.b14025127 _b2021-05-28 _c2019-11-12
942			_c01 _n0 _kTK7871.15.C4C465
914			_avtls003359541
990			_amaa
991			_aPusat Pengajian Fizik Gunaan(QFB)
998			_al _b2007-02-11 _cm _da _feng _gflu _y0 _z.b14025127
999			_c398770 _d398770