| 000 | 01133nam a2200301 a 4500 | ||
|---|---|---|---|
| 005 | 20250914154543.0 | ||
| 007 | hd ufu baaa | ||
| 008 | 061218s1993 xxu a 00 eng | ||
| 039 | 9 |
_a200804201629 _bnordin _y12-18-2006 _znordin |
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| 040 | _aUKM | ||
| 090 | _amikrofilem tesis TK7871.85.M84 2006 | ||
| 090 |
_amikrofilem tesis TK7871.85 _b.M84 2006 |
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| 100 | 0 | _aMohd. Salleh Ismail | |
| 245 | 1 | 0 |
_aTechnology and application of aligned wafer bonding for three dimensional microstructures and microdevices _h[microform] / _cby Mohd Salleh Ismail |
| 260 |
_aDavis, Calif. _bPerpustakaan Tun Seri Lanang, _c2006 |
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| 300 |
_a1 microfilm reel ; _c35 mm. |
||
| 502 | _aThesis (Doctor of Philosophy) - University of California, 1993 | ||
| 590 | _a1 | ||
| 650 | _aSemiconductor wafers | ||
| 650 |
_aIntegrated circuits _xWater _xscale integration |
||
| 907 |
_a.b13838015 _b2022-05-23 _c2019-11-12 |
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| 942 |
_c3 _n0 _kmikrofilem tesis TK7871.85.M84 2006 |
||
| 914 | _avtls003339114 | ||
| 990 | _anordin | ||
| 991 | _aFakulti Kejuruteraan | ||
| 998 |
_at _b2006-05-12 _cm _dy _feng _gxxu _y0 _z.b13838015 |
||
| 999 |
_c381441 _d381441 |
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