000			01336cam a22003134a 4500
005			20250930122006.0
008			060718s2005 nyua b 001 0 eng
039		9	_a200607271913 _bjamil _c200607181215 _didah _y07-18-2006 _zidah
090			_aTK7870.15.F356 3
090			_aTK7870.15 _b.F356
245	0	0	_aFailure-free integrated circuit packages : _bsystematic elimination of failures through reliability engineering, failure analysis, and material improvements / _cCharles Cohn, Charles A. Harper, [editors]
260			_aNew York : _bMcGraw-Hill, _c2005
300			_axix, 363 p. : _bill. ; _c24 cm.
440		0	_aMcGraw-Hill professional engineering
504			_aIncludes bibliographical references and index
650		0	_aMicroelectronic packaging _960415
650		0	_aIntegrated circuits _xFault tolerance
700	1		_aCohn, Charles
700	1		_aHarper, Charles A.
856	4	2	_3Contributor biographical information _uhttp://www.loc.gov/catdir/bios/mh051/2004533584.html
856	4	1	_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh051/2004533584.html
907			_a.b13768517 _b2021-05-28 _c2019-11-12
942			_c01 _n0 _kTK7870.15.F356 3
914			_avtls003331454
990			_ajj
991			_aInstitut Sains Angkasa - Pasca
998			_al _b2006-05-07 _cm _da _feng _gnyu _y0 _z.b13768517
999			_c375069 _d375069