000 01268cam a22003254a 4500
005 20250914143418.0
008 050628s2006 xxua b 001 0 eng
020 _a0071455442 (acid-free paper)
_cRM556.50
039 9 _a200609081126
_bjamil
_c200608141028
_didah
_c200605031955
_dzakir
_y05-03-2006
_zzakir
090 _aTP1180.E6P48 pasca
090 _aTP1180.E6
_bP48
100 1 _aPetrie, Edward M.
245 1 0 _aEpoxy adhesive formulations /
_cEdward M. Petrie
260 _aNew York :
_bMcGraw-Hill,
_c2006
300 _axv, 535 p. :
_bill. ;
_c24 cm.
504 _aIncludes bibliographical references and index
650 0 _aEpoxy resins
_xFormability
650 0 _aEpoxy compounds
_xFormability
650 0 _aEpoxy coatings
_xFormability
650 0 _aAdhesives
_xFormability
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/enhancements/fy0625/2005051088-b.html
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/enhancements/fy0625/2005051088-d.html
907 _a.b13721884
_b2020-10-15
_c2019-11-12
942 _c01
_n0
_kTP1180.E6P48 pasca
914 _avtls003326404
990 _ajj
991 _aProgram Sains Bahan - Pasca
998 _al
_b2006-03-05
_cm
_da
_feng
_gxxu
_y0
_z.b13721884
999 _c370684
_d370684